Plasma Injection Moulds Surface Treatment Equipment
Advanced plasma cleaning machine designed for the semiconductor and optoelectronic industry, featuring German core plasma technology and precision engineering for superior surface treatment performance.
Product Overview
This compact vacuum plasma cleaning machine utilizes inductive coupling technology and excels in insulating microwave tubes and components. Ideal for processing sensitive products requiring high cleanliness standards, it effectively treats plastics, biochemical materials, PDMS, glass, metal semiconductors, ceramics, composites, polymers, and other materials to achieve superior surface cleaning, sterilization, wettability enhancement, surface property modification, and improved binding force.
Key Features
- Optimized for small-scale production and scientific research applications
- Compact design with easy operation and maintenance
- German core plasma technology for reliable performance
- Corrosion-resistant imported 316 stainless steel construction
- Precision flow control with imported needle valves
- Dual-process reactant gas channels for versatile applications
- Customization options available for specific requirements
Technical Specifications
| Parameter |
Specification |
| Vacuum Degree |
30Pa-100Pa |
| Gas Flow |
0-100ml/s |
| Cleaning Time |
Adjustable (1-9999s) |
| Cooling Mode |
Air cooling |
| Gas Channels |
Two-way working gas (Argon, hydrogen, oxygen, nitrogen, air, etc.) |
| Control Systems |
PLC + Touch screen |
| Vacuum Cavity Temperature |
<50 ℃ |
| Vacuum Pump |
Oil pump/dry pump (optional) |
| Power Supply |
AC220V(±10V) |
Specialized equipment can be customized for different material forms, sizes, and production capacity requirements.
Equipment Components
The plasma cleaning system consists of five main components:
- Reaction Chamber: Comprising vacuum chamber and electrodes, providing the plasma reaction space for processing items
- Vacuum System: Includes vacuum gauge, vacuum pump, and piping to evacuate air and maintain optimal vacuum levels
- Discharge System: Supplies energy to excite reaction gas ionization and generate required plasma
- Electronic Control System: Controls equipment operation according to optimal process parameters and maintains stability
- Intake Flow Control System: Features flow meters and solenoid valves for precise gas flow control and vacuum maintenance
Operation Procedure
- Open vacuum chamber door, place items for processing, and close door securely
- Activate main power switch and configure parameters via touch screen interface
- Equipment automatically executes set parameters (vacuum → air intake → discharge → empty)
- Buzzer signals completion of processing cycle
- Open chamber door and remove processed items
Plasma Technology Principles
Plasma Introduction
Plasma represents the fourth state of matter, alongside solid, liquid, and gas. Utilizing high-energy particles, plasma enables surface activation, etching, and decontamination through physical and chemical reactions, improving material surface properties including friction coefficient, adhesion, and hydrophilicity.
Plasma Cleaning Effects
Plasma cleaning technology leverages low-temperature plasma characteristics to chemically and physically clean material surfaces, enhancing smoothness, implanting new chemical functional groups, and enabling precise etching.
Surface Cleaning and Activation
Functional Group Formation
Introducing reactant gases into discharged gas creates complex chemical reactions on activated material surfaces, generating new functional groups such as hydrocarbyl, amidogen, and carboxyl that significantly enhance surface activity.
Plasma Etching
Plasma etching removes volatile gaseous substances generated by creating plasma from selected gases and solid surface materials. This reactive plasma process offers high etching rates and uniformity, with plasma parameters critically influencing etching effectiveness.
Plasma Cleaning Process
Advantages of Plasma Cleaning
- Environmentally friendly alternative to traditional wet cleaning (VOC-free)
- Low operational costs using gas as reaction medium (oxygen)
- Broad application range without material discrimination
- High cleaning efficiency with automation capabilities
- Simultaneous dirt removal and surface property enhancement
Performance Comparison
Contact angle measurement determines liquid wettability on solid surfaces. Angles below 90° indicate hydrophilic surfaces with better wettability at smaller angles, while angles above 90° indicate hydrophobic characteristics.
Dyne value measurement assesses material surface bonding capability in printing, coating, laminating, and welding applications. Higher dyne values indicate superior bonding performance with other materials.
Common Applications
Surface modification of polymer materials to improve bonding properties
Removal of oxide residue from electronic components to enhance bonding quality and effectiveness
Glass substrate organic contaminant removal
Metal surface oil removal
Graphene and powder cleaning modification
PDMS surface activated bonding
Quality Assurance & Service
Comprehensive 1-year warranty with technical support throughout the warranty period. Complete documentation and training provided for optimal equipment operation and maintenance.
- Complete technical documentation including operation, commissioning, and maintenance manuals with circuit, gas circuit, and pipeline diagrams
- Detailed installation preparation guidance
- Comprehensive remote training covering normal operation, repair, maintenance, problem analysis, and emergency procedures
- Technical support and warranty documentation with contact information
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